Cold-spray bonding mechanisms and deposition efficiency prediction for particle/substrate with distinct deformability

  • Fanchao Meng
  • , Dianyin Hu
  • , Ye Gao
  • , Stephen Yue
  • , Jun Song*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Cold-spray involving particle and substrate that are of distinct deformability, i.e., soft (particle)/hard (substrate) and hard (particle)/soft (substrate) systems, has been investigated using systematic numerical simulations. For the soft/hard system, the bonding and deposition is dominantly controlled by particle plasticity. In contrast, physical trapping and mechanical interlocking play an important role for the hard/soft system. Employing a layered-particle/substrate model and a crater-particles model, we demonstrated the operation and playoff of different bonding mechanisms, and provided predictive assessments of the deposition efficiency that correspond well to experimental measurements. The present study offers key mechanistic insights towards rational process design of cold-spray.

Original languageEnglish
Pages (from-to)503-510
Number of pages8
JournalMaterials and Design
Volume109
DOIs
StatePublished - 5 Nov 2016

Keywords

  • Bonding mechanism
  • Cold-spray
  • Deposition efficiency
  • Finite element analysis
  • Impact behavior
  • Johnson-Cook model

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