Characterization of the arrangement feature of copper interconnects by Moiré inversion method

This paper explores the planar arrangement feature of the copper interconnects in a view field of several millimeters by the focused ion-beam (FIB) Moiré inversion method quantitatively. The curved FIB Moiré patterns indicate that the copper interconnects are a series of curves with continuous variations instead of beelines. The control equation set of the copper interconnects central lines is attained through the Moiré inversion method. This work can be extended to inspect the structural defects and provide a reliable support for the interconnects structure fabrication.