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Characterization and Compact Modeling of the Thermal Resistance of SiGe HBTs From Cryogenic to Room Temperature

  • Xiaodi Jin*
  • , Guangsheng Liang
  • , Markus Muller
  • , Michael Schroter
  • *Corresponding author for this work
  • Technische Universität Dresden

Research output: Contribution to journalArticlepeer-review

Abstract

The thermal resistance Rth of SiGe heterojunction bipolar transistors (HBTs) is characterized and modeled at cryogenic temperatures up to room temperature (RT). A physics-based analytical solution for the thermal resistance has been derived for this wide temperature range. Two formulations including both chuck temperature and power dependence of Rth have been developed and show good agreement with data from both 3-D thermal simulation and measurements.

Original languageEnglish
Pages (from-to)4800-4807
Number of pages8
JournalIEEE Transactions on Electron Devices
Volume70
Issue number9
DOIs
StatePublished - 1 Sep 2023
Externally publishedYes

Keywords

  • Compact modeling
  • cryogenic operation
  • heterojunction bipolar transistor (HBT)
  • low-temperature electronics
  • thermal resistance

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