Abstract
Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn2, Ag3Sn and AuSn4. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.
| Original language | English |
|---|---|
| Pages (from-to) | 670-673 |
| Number of pages | 4 |
| Journal | Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics |
| Volume | 39 |
| Issue number | 5 |
| State | Published - May 2013 |
Keywords
- Au60AgCu alloy
- Brittle fracture
- Intermetallic compound
- Tin-lead solder
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