Atomistic simulation of the mechanical behaviors of Cu/SiC nanocomposites

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

Original language	English
State	Published - 2011
Event	18th International Conference on Composites Materials, ICCM 2011 - Jeju, Korea, Republic of Duration: 21 Aug 2011 → 26 Aug 2011

Conference	18th International Conference on Composites Materials, ICCM 2011
Country/Territory	Korea, Republic of
City	Jeju
Period	21/08/11 → 26/08/11

Keywords

@conference{413c27b3bb9e4b16a2e146f046e22c57,

title = "Atomistic simulation of the mechanical behaviors of Cu/SiC nanocomposites",

keywords = "Cu/SiC nanocomposites, Interpenetrating phase nanocomposites, Mechanical properties, Molecular dynamics",

author = "Yang, \{Z. Y.\} and Lu, \{Z. X.\} and T. Wang",

year = "2011",

language = "英语",

note = "18th International Conference on Composites Materials, ICCM 2011 ; Conference date: 21-08-2011 Through 26-08-2011",

}

TY - CONF

T1 - Atomistic simulation of the mechanical behaviors of Cu/SiC nanocomposites

AU - Yang, Z. Y.

AU - Lu, Z. X.

AU - Wang, T.

PY - 2011

Y1 - 2011

KW - Cu/SiC nanocomposites

KW - Interpenetrating phase nanocomposites

KW - Mechanical properties

KW - Molecular dynamics

UR - https://www.scopus.com/pages/publications/84875939675

M3 - 论文

AN - SCOPUS:84875939675

T2 - 18th International Conference on Composites Materials, ICCM 2011

Y2 - 21 August 2011 through 26 August 2011

ER -