TY - GEN
T1 - Analysis on air-side characteristics of the condenser at low ambient pressure conditions
AU - Zhang, Xingjuan
AU - Gao, Feng
AU - Wang, Chao
AU - Yang, Chunxin
PY - 2012
Y1 - 2012
N2 - The vapor cycle refrigeration system is used in aircraft cooling. The changes of the ambient air properties will affect the condenser performance of the vapor cycle refrigeration system. The air-side characteristics between the flow and pressure drop at low pressure conditions must be taken into account, especially when it is used in the aircraft. Through the three tests of the condenser fan, the condenser, and the condenser module, the common property model of the air-side flow and pressure head/drop for each part is established and experimentally verified. The results show that the flow and pressure head or drop relationship of each unit under different pressures of 101.3kPa, 79.5kPa, 61.7kPa, and 47.2kPa is simply deduced by means of the ground test. From this study, the operation points of the condenser module under low ambient pressure conditions can be derived as well.
AB - The vapor cycle refrigeration system is used in aircraft cooling. The changes of the ambient air properties will affect the condenser performance of the vapor cycle refrigeration system. The air-side characteristics between the flow and pressure drop at low pressure conditions must be taken into account, especially when it is used in the aircraft. Through the three tests of the condenser fan, the condenser, and the condenser module, the common property model of the air-side flow and pressure head/drop for each part is established and experimentally verified. The results show that the flow and pressure head or drop relationship of each unit under different pressures of 101.3kPa, 79.5kPa, 61.7kPa, and 47.2kPa is simply deduced by means of the ground test. From this study, the operation points of the condenser module under low ambient pressure conditions can be derived as well.
KW - Condenser
KW - Fan
KW - Low pressure
KW - Vapor cycle refrigeration systems
UR - https://www.scopus.com/pages/publications/84892648629
U2 - 10.1115/HT2012-58615
DO - 10.1115/HT2012-58615
M3 - 会议稿件
AN - SCOPUS:84892648629
SN - 9780791844779
T3 - ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
SP - 475
EP - 479
BT - ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
T2 - ASME 2012 Heat Transfer Summer Conference Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
Y2 - 8 July 2012 through 12 July 2012
ER -