Analysis of thermal stress in InP/GaAs bonding by finite element method

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	277
Number of pages	1
Journal	Bandaoti Guangdian/Semiconductor Optoelectronics
Volume	25
Issue number	4
State	Published - Aug 2004

Cite this

@article{ce5abb157a25439489e1325dff7c0a69,

title = "Analysis of thermal stress in InP/GaAs bonding by finite element method",

author = "Bin Chen and Zhen Zhou and Huang, \{Yong Qing\} and Ren, \{Xiao Min\}",

year = "2004",

month = aug,

language = "英语",

volume = "25",

pages = "277",

journal = "Bandaoti Guangdian/Semiconductor Optoelectronics",

issn = "1001-5868",

publisher = "China National Publishing Industry Trading Corporation",

number = "4",

}

TY - JOUR

T1 - Analysis of thermal stress in InP/GaAs bonding by finite element method

AU - Chen, Bin

AU - Zhou, Zhen

AU - Huang, Yong Qing

AU - Ren, Xiao Min

PY - 2004/8

Y1 - 2004/8

UR - https://www.scopus.com/pages/publications/5144225431

M3 - 文章

AN - SCOPUS:5144225431

SN - 1001-5868

VL - 25

SP - 277

JO - Bandaoti Guangdian/Semiconductor Optoelectronics

JF - Bandaoti Guangdian/Semiconductor Optoelectronics

IS - 4

ER -