TY - GEN
T1 - An Tissue-Adhesive Piezoelectric Soft Sensor for in Vivo Healthcare
AU - Wang, Chan
AU - Liu, Zhuo
AU - Liu, Ying
AU - Shan, Yizhu
AU - Qu, Xuecheng
AU - Xue, Jiangtao
AU - He, Tianyiyi
AU - Zhou, Hong
AU - Liu, Weixin
AU - Li, Zhou
AU - Lee, Chengkuo
N1 - Publisher Copyright:
© 2023 IEEJ.
PY - 2023
Y1 - 2023
N2 - Forming a stale dynamic interaction interface between the tissue and implants is important. This paper proposed a tissue-adhesive piezoelectric soft sensor (TPSS) for in vivo blood pressure monitoring. An adhesive hydrogel (AH) was designed with superior adhesion performance to both engineering materials and biological tissues. With the AH as a tissue-adhesive layer, TPSS was adhered on the surface of an artery to monitor real-time blood pressure states, as well as the heart rate and respiratory rate. Compared to commercial sensors that worked by inserting into tissues, TPSS didn't cause any damage and could be torn off after service.
AB - Forming a stale dynamic interaction interface between the tissue and implants is important. This paper proposed a tissue-adhesive piezoelectric soft sensor (TPSS) for in vivo blood pressure monitoring. An adhesive hydrogel (AH) was designed with superior adhesion performance to both engineering materials and biological tissues. With the AH as a tissue-adhesive layer, TPSS was adhered on the surface of an artery to monitor real-time blood pressure states, as well as the heart rate and respiratory rate. Compared to commercial sensors that worked by inserting into tissues, TPSS didn't cause any damage and could be torn off after service.
KW - Adhesive Hydrogel
KW - Blood Pressure Sensor
KW - Device-Tissue Interfaces
KW - Mussel Adhesive Protein
KW - Piezoelectric Sensor
UR - https://www.scopus.com/pages/publications/85193512029
M3 - 会议稿件
AN - SCOPUS:85193512029
T3 - 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
SP - 10
EP - 13
BT - 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Y2 - 25 June 2023 through 29 June 2023
ER -