TY - GEN
T1 - An Efficient Planar Bundle Adjustment Algorithm
AU - Zhou, Lipu
AU - Koppel, Daniel
AU - Ju, Hul
AU - Steinbruecker, Frank
AU - Kaess, Michael
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/11
Y1 - 2020/11
N2 - This paper presents an efficient algorithm for the least-squares problem using the point-to-plane cost, which aims to jointly optimize depth sensor poses and plane parameters for 3D reconstruction. We call this least-squares problem Planar Bundle Adjustment (PBA), due to the similarity between this problem and the original Bundle Adjustment (BA) in visual reconstruction. As planes ubiquitously exist in the man-made environment, they are generally used as landmarks in SLAM algorithms for various depth sensors. PBA is important to reduce drift and improve the quality of the map. However, directly adopting the well-established BA framework in visual reconstruction will result in a very inefficient solution for PBA. This is because a 3D point only has one observation at a camera pose. In contrast, a depth sensor can record hundreds of points in a plane at a time, which results in a very large nonlinear least-squares problem even for a small-scale space. The main contribution of this paper is an efficient solution for the PBA problem using the point-to-plane cost. We introduce a reduced Jacobian matrix and a reduced residual vector, and prove that they can replace the original Jacobian matrix and residual vector in the generally adopted Levenberg-Marquardt (LM) algorithm. This significantly reduces the computational cost. Besides, when planes are combined with other features for 3D reconstruction, the reduced Jacobian matrix and residual vector can also replace the corresponding parts derived from planes. Our experimental results show that our algorithm can significantly reduce the computational time compared to the solution using the traditional BA framework. In addition, our algorithm is faster, more accurate, and more robust to initialization errors compared to the start-of-the-art solution using the plane-to-plane cost [3].
AB - This paper presents an efficient algorithm for the least-squares problem using the point-to-plane cost, which aims to jointly optimize depth sensor poses and plane parameters for 3D reconstruction. We call this least-squares problem Planar Bundle Adjustment (PBA), due to the similarity between this problem and the original Bundle Adjustment (BA) in visual reconstruction. As planes ubiquitously exist in the man-made environment, they are generally used as landmarks in SLAM algorithms for various depth sensors. PBA is important to reduce drift and improve the quality of the map. However, directly adopting the well-established BA framework in visual reconstruction will result in a very inefficient solution for PBA. This is because a 3D point only has one observation at a camera pose. In contrast, a depth sensor can record hundreds of points in a plane at a time, which results in a very large nonlinear least-squares problem even for a small-scale space. The main contribution of this paper is an efficient solution for the PBA problem using the point-to-plane cost. We introduce a reduced Jacobian matrix and a reduced residual vector, and prove that they can replace the original Jacobian matrix and residual vector in the generally adopted Levenberg-Marquardt (LM) algorithm. This significantly reduces the computational cost. Besides, when planes are combined with other features for 3D reconstruction, the reduced Jacobian matrix and residual vector can also replace the corresponding parts derived from planes. Our experimental results show that our algorithm can significantly reduce the computational time compared to the solution using the traditional BA framework. In addition, our algorithm is faster, more accurate, and more robust to initialization errors compared to the start-of-the-art solution using the plane-to-plane cost [3].
KW - Bundle Adjustment
KW - Depth Sensor
KW - Nonlinear Optimization
KW - SLAM
UR - https://www.scopus.com/pages/publications/85099295727
U2 - 10.1109/ISMAR50242.2020.00035
DO - 10.1109/ISMAR50242.2020.00035
M3 - 会议稿件
AN - SCOPUS:85099295727
T3 - Proceedings - 2020 IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020
SP - 136
EP - 145
BT - Proceedings - 2020 IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th IEEE International Symposium on Mixed and Augmented Reality, ISMAR 2020
Y2 - 9 November 2020 through 13 November 2020
ER -