An Active Junction Temperature Control Method Based on Thermoelectric Coolers

Xiaofeng Ding; Xinrong Song; Zhenyu Shan

doi:10.1109/ECCE44975.2020.9236424

An Active Junction Temperature Control Method Based on Thermoelectric Coolers

Xiaofeng Ding
, Xinrong Song
, Zhenyu Shan

School of Automation Science and Electrical Engineering

Beihang University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Thermal stress caused by junction temperature fluctuations is one of the main factors reducing the reliability of the power semiconductor devices. Hence, in order to reduce the severe junction temperature fluctuation, this paper proposed a novel active junction temperature control method based on thermoelectric coolers (TEC). Firstly, the thermal model of the inverter-TEC system was established. Secondly, a hysteresis loop junction temperature control method was proposed. Then, TEC power consumption and the efficiency of the inverter-TEC system were analyzed. Finally, a simulation was implemented and results verified the proposed method. The maximum junction temperature fluctuation is reduced significantly by 65.4% in Urban Dynamometer Driving Schedule (UDDS) condition. Meanwhile, the average junction temperature is dropped by 5.96%. Therefore, the lifetime of power devices can be extended.

Original language	English
Title of host publication	ECCE 2020 - IEEE Energy Conversion Congress and Exposition
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	3306-3311
Number of pages	6
ISBN (Electronic)	9781728158266
DOIs	https://doi.org/10.1109/ECCE44975.2020.9236424
State	Published - 11 Oct 2020
Event	12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020 - Virtual, Detroit, United States Duration: 11 Oct 2020 → 15 Oct 2020

Publication series

Name	ECCE 2020 - IEEE Energy Conversion Congress and Exposition

Conference

Conference	12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020
Country/Territory	United States
City	Virtual, Detroit
Period	11/10/20 → 15/10/20

Keywords

efficiency
junction temperature control
power device
reliability
thermoelectric coolers

Access to Document

10.1109/ECCE44975.2020.9236424

Cite this

Ding, X., Song, X., & Shan, Z. (2020). An Active Junction Temperature Control Method Based on Thermoelectric Coolers. In ECCE 2020 - IEEE Energy Conversion Congress and Exposition (pp. 3306-3311). Article 9236424 (ECCE 2020 - IEEE Energy Conversion Congress and Exposition). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECCE44975.2020.9236424

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title = "An Active Junction Temperature Control Method Based on Thermoelectric Coolers",

abstract = "Thermal stress caused by junction temperature fluctuations is one of the main factors reducing the reliability of the power semiconductor devices. Hence, in order to reduce the severe junction temperature fluctuation, this paper proposed a novel active junction temperature control method based on thermoelectric coolers (TEC). Firstly, the thermal model of the inverter-TEC system was established. Secondly, a hysteresis loop junction temperature control method was proposed. Then, TEC power consumption and the efficiency of the inverter-TEC system were analyzed. Finally, a simulation was implemented and results verified the proposed method. The maximum junction temperature fluctuation is reduced significantly by 65.4\% in Urban Dynamometer Driving Schedule (UDDS) condition. Meanwhile, the average junction temperature is dropped by 5.96\%. Therefore, the lifetime of power devices can be extended.",

keywords = "efficiency, junction temperature control, power device, reliability, thermoelectric coolers",

author = "Xiaofeng Ding and Xinrong Song and Zhenyu Shan",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020 ; Conference date: 11-10-2020 Through 15-10-2020",

year = "2020",

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doi = "10.1109/ECCE44975.2020.9236424",

language = "英语",

series = "ECCE 2020 - IEEE Energy Conversion Congress and Exposition",

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Ding, X, Song, X & Shan, Z 2020, An Active Junction Temperature Control Method Based on Thermoelectric Coolers. in ECCE 2020 - IEEE Energy Conversion Congress and Exposition., 9236424, ECCE 2020 - IEEE Energy Conversion Congress and Exposition, Institute of Electrical and Electronics Engineers Inc., pp. 3306-3311, 12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020, Virtual, Detroit, United States, 11/10/20. https://doi.org/10.1109/ECCE44975.2020.9236424

An Active Junction Temperature Control Method Based on Thermoelectric Coolers. / Ding, Xiaofeng; Song, Xinrong; Shan, Zhenyu.
ECCE 2020 - IEEE Energy Conversion Congress and Exposition. Institute of Electrical and Electronics Engineers Inc., 2020. p. 3306-3311 9236424 (ECCE 2020 - IEEE Energy Conversion Congress and Exposition).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - An Active Junction Temperature Control Method Based on Thermoelectric Coolers

AU - Ding, Xiaofeng

AU - Song, Xinrong

AU - Shan, Zhenyu

PY - 2020/10/11

Y1 - 2020/10/11

N2 - Thermal stress caused by junction temperature fluctuations is one of the main factors reducing the reliability of the power semiconductor devices. Hence, in order to reduce the severe junction temperature fluctuation, this paper proposed a novel active junction temperature control method based on thermoelectric coolers (TEC). Firstly, the thermal model of the inverter-TEC system was established. Secondly, a hysteresis loop junction temperature control method was proposed. Then, TEC power consumption and the efficiency of the inverter-TEC system were analyzed. Finally, a simulation was implemented and results verified the proposed method. The maximum junction temperature fluctuation is reduced significantly by 65.4% in Urban Dynamometer Driving Schedule (UDDS) condition. Meanwhile, the average junction temperature is dropped by 5.96%. Therefore, the lifetime of power devices can be extended.

AB - Thermal stress caused by junction temperature fluctuations is one of the main factors reducing the reliability of the power semiconductor devices. Hence, in order to reduce the severe junction temperature fluctuation, this paper proposed a novel active junction temperature control method based on thermoelectric coolers (TEC). Firstly, the thermal model of the inverter-TEC system was established. Secondly, a hysteresis loop junction temperature control method was proposed. Then, TEC power consumption and the efficiency of the inverter-TEC system were analyzed. Finally, a simulation was implemented and results verified the proposed method. The maximum junction temperature fluctuation is reduced significantly by 65.4% in Urban Dynamometer Driving Schedule (UDDS) condition. Meanwhile, the average junction temperature is dropped by 5.96%. Therefore, the lifetime of power devices can be extended.

KW - efficiency

KW - junction temperature control

KW - power device

KW - reliability

KW - thermoelectric coolers

UR - https://www.scopus.com/pages/publications/85097153447

U2 - 10.1109/ECCE44975.2020.9236424

DO - 10.1109/ECCE44975.2020.9236424

M3 - 会议稿件

AN - SCOPUS:85097153447

T3 - ECCE 2020 - IEEE Energy Conversion Congress and Exposition

SP - 3306

EP - 3311

BT - ECCE 2020 - IEEE Energy Conversion Congress and Exposition

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2020

Y2 - 11 October 2020 through 15 October 2020

ER -

An Active Junction Temperature Control Method Based on Thermoelectric Coolers

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