Accurately nonselective and selective etching of GaAs/Al 0.8Ga0.2As/AlAs structure for making air-gap cavity

  • Zhen Zhou*
  • , Yun Du
  • , Yongqing Huang
  • , Ronghan Wu
  • , Xiaomin Ren
  • *Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

We have demonstrated a wet etching technique capable of fabricating air-gap cavity. The process utilizes nonselective and selective etchants respectively to form air-gap cavity. The etching characteristics of GaAs/Al 0.8Ga0.2As/AlAs structure in different nonselective and selective etchants are investigated. The volumetric 3:2:20 ratios of H 3PO4/H2O2/H2O solution and volumetric 600:1 ratio of DI water/buffered oxide [mixture of 7:1 NH 4F(36%)-HF(6.4%)] solution are better nonselective and selective etchants respectively. We have used this process technique to form a tunable air-gap cavity optical filter. The measure results of the transmission spectral show that the air-gap cavity has high optical quality. These simple etching processes can be applied to fabricate the air-gap cavity devices.

Original languageEnglish
Pages (from-to)889-895
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5280 II
DOIs
StatePublished - 2003
Externally publishedYes
EventAPOC 2003: Asia-Pacific Optical and Wireless Communications: Materials, Active Devices, and Optical Amplifier - Wuhan, China
Duration: 4 Nov 20036 Nov 2003

Keywords

  • Air-gap cavity
  • Al GaAs
  • AlAs
  • GaAs
  • Nonselective etching
  • Selective etching

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