TY - GEN
T1 - Acceleration Life Test Design Method of Electronic Module under Multiple Coupling Stress Condition
AU - Wang, Zhen
AU - Su, Fengxiang
AU - Zhang, Zhaofeng
AU - Chen, Ying
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/10
Y1 - 2020/10
N2 - Under complex working conditions, solder joints are often subjected to the combined effects of temperature, vibration, humidity, and electrical stress. Under the coupling of multiple stresses, its life is significantly shorter than that of a single stress. Therefore, studying the failure mechanism and acceleration factor calculation method of solder joints under the coupling of multiple stresses is very important to accurately evaluate or predict the life of electronic products in engineering. In order to more accurately predict the product life under the action of multiple stresses, a new method for calculating the acceleration factor of solder joints under the coupling of multiple stresses is proposed in this paper. By studying the failure mechanism of the solder joints of electronic products under a single stress and the interaction of the failure mechanisms under the coupling of two or more stresses, the calculation methods of the solder joint life and acceleration factors under two or more stress couplings are obtained. Taking a circuit board as an example, the acceleration factor of the accelerated test of the interconnection solder joint under the coupling of temperature, humidity, vibration and electrical stress is calculated.
AB - Under complex working conditions, solder joints are often subjected to the combined effects of temperature, vibration, humidity, and electrical stress. Under the coupling of multiple stresses, its life is significantly shorter than that of a single stress. Therefore, studying the failure mechanism and acceleration factor calculation method of solder joints under the coupling of multiple stresses is very important to accurately evaluate or predict the life of electronic products in engineering. In order to more accurately predict the product life under the action of multiple stresses, a new method for calculating the acceleration factor of solder joints under the coupling of multiple stresses is proposed in this paper. By studying the failure mechanism of the solder joints of electronic products under a single stress and the interaction of the failure mechanisms under the coupling of two or more stresses, the calculation methods of the solder joint life and acceleration factors under two or more stress couplings are obtained. Taking a circuit board as an example, the acceleration factor of the accelerated test of the interconnection solder joint under the coupling of temperature, humidity, vibration and electrical stress is calculated.
KW - acceleration factor
KW - multiple stress coupling
KW - solder joint life
UR - https://www.scopus.com/pages/publications/85099307496
U2 - 10.1109/PHM-Jinan48558.2020.00026
DO - 10.1109/PHM-Jinan48558.2020.00026
M3 - 会议稿件
AN - SCOPUS:85099307496
T3 - Proceedings - 11th International Conference on Prognostics and System Health Management, PHM-Jinan 2020
SP - 112
EP - 115
BT - Proceedings - 11th International Conference on Prognostics and System Health Management, PHM-Jinan 2020
A2 - Li, Chuan
A2 - Gjorgjevikj, Dejan
A2 - Yang, Zhe
A2 - Pu, Ziqiang
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th International Conference on Prognostics and System Health Management, PHM-Jinan 2020
Y2 - 23 October 2020 through 25 October 2020
ER -