TY - GEN
T1 - A thermal balance oriented task mapping for CMPs
AU - Wang, Jian
AU - Lu, Jinzhi
AU - Guo, Shize
AU - Chen, Zhe
AU - Li, Yubai
N1 - Publisher Copyright:
© 2018 Association for Computing Machinery.
PY - 2018/8/22
Y1 - 2018/8/22
N2 - CMP (Chip Multi Processors) has been concerned and applied in more and more fields. With the technical progress in semiconductor manufacturing, the focus/research on on-chip power density and heat generation of the chips are increasing. The heat distribution of the chip heavily affects its reliability. In this article a heat-balancing task mapping algorithm is proposed to optimize the heat distribution and ensure the reliability of CMP. First, the thermal distribution of CMP is analyzed by what. Then, based on above analysis, a cost function based on usage and location of on-chip processors is proposed. Finally, a mapping algorithm based on above cost function is .developed to assign threads to cores while running applications with the min-cost principle dynamically. The simulation results revel that the heat-balancing algorithm proposed effectively optimizes heat distribution and ensures computational performance either.
AB - CMP (Chip Multi Processors) has been concerned and applied in more and more fields. With the technical progress in semiconductor manufacturing, the focus/research on on-chip power density and heat generation of the chips are increasing. The heat distribution of the chip heavily affects its reliability. In this article a heat-balancing task mapping algorithm is proposed to optimize the heat distribution and ensure the reliability of CMP. First, the thermal distribution of CMP is analyzed by what. Then, based on above analysis, a cost function based on usage and location of on-chip processors is proposed. Finally, a mapping algorithm based on above cost function is .developed to assign threads to cores while running applications with the min-cost principle dynamically. The simulation results revel that the heat-balancing algorithm proposed effectively optimizes heat distribution and ensures computational performance either.
UR - https://www.scopus.com/pages/publications/85055702310
U2 - 10.1145/3268891.3268902
DO - 10.1145/3268891.3268902
M3 - 会议稿件
AN - SCOPUS:85055702310
T3 - ACM International Conference Proceeding Series
SP - 12
EP - 16
BT - Proceedings of the 8th International Conference on Information Communication and Management, ICICM 2018
PB - Association for Computing Machinery
T2 - 8th International Conference on Information Communication and Management, ICICM 2018
Y2 - 22 August 2018 through 24 August 2018
ER -