TY - GEN
T1 - A systematic approach for reliability assessment of electrolytic capacitor-free LED drivers
AU - Sun, Bo
AU - Fan, Xuejun
AU - Van Driel, Willem
AU - Zhang, Guoqi
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/4/29
Y1 - 2016/4/29
N2 - In this paper, a systematic approach for reliability assessment of electrolytic capacitor-free LED drivers is developed to investigate the failure rate of MOSFETs in the drivers. An original fly-back driver with electrolytic capacitor and two modified electrolytic capacitor-free drivers are studied, and their performances are compared. Due to LED lumen depreciation during operation, current of the MOSFET decreases over time, which cancels out the effect of junction temperature increase. As a result, the junction temperature of MOSFET increase mildly for the case study, but failure rate is accelerated.
AB - In this paper, a systematic approach for reliability assessment of electrolytic capacitor-free LED drivers is developed to investigate the failure rate of MOSFETs in the drivers. An original fly-back driver with electrolytic capacitor and two modified electrolytic capacitor-free drivers are studied, and their performances are compared. Due to LED lumen depreciation during operation, current of the MOSFET decreases over time, which cancels out the effect of junction temperature increase. As a result, the junction temperature of MOSFET increase mildly for the case study, but failure rate is accelerated.
KW - Electrolytic Capacitor-Free LED Driver
KW - MOSFET
KW - Reliability
UR - https://www.scopus.com/pages/publications/84974625058
U2 - 10.1109/EuroSimE.2016.7463387
DO - 10.1109/EuroSimE.2016.7463387
M3 - 会议稿件
AN - SCOPUS:84974625058
T3 - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Y2 - 18 April 2016 through 20 April 2016
ER -