TY - GEN
T1 - A SPICE-based transient thermal-electronic model for LEDs
AU - Sun, Bo
AU - Fan, Jiajie
AU - Fan, Xuejun
AU - Zhang, Guoqi
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/3
Y1 - 2019/3
N2 - In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model's temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED's AC behavior. Thermal model and optical model can be integrated with the LED's electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.
AB - In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model's temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED's AC behavior. Thermal model and optical model can be integrated with the LED's electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.
KW - Electronic Modelling
KW - LED
KW - Reliability
KW - Thermal-Electronic Simulation
KW - Visible Light Communication
UR - https://www.scopus.com/pages/publications/85067519484
U2 - 10.1109/EuroSimE.2019.8724555
DO - 10.1109/EuroSimE.2019.8724555
M3 - 会议稿件
AN - SCOPUS:85067519484
T3 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Y2 - 24 March 2019 through 27 March 2019
ER -