TY - GEN
T1 - A Reliability Assessment Approach for the Biomimetic Neuron Circuit
AU - Sun, Bo
AU - Lei, Ziquan
AU - Guo, Chunbing
AU - Zhang, Guohao
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - Performance of biomimetic neurons used in novel communication systems depends on its capacitors. Thus, degradation of capacitors in neurons may have significant impact on reliability of such a communication system. In this paper, a simulation-based reliability assessment approach is developed for biomimetic neuron circuits to consider the degradation of capacitors. SPICE simulation, neural coding/decoding method, and degradation modelling of capacitors are integrated to assess impact of capacitors on the given neuron circuit. A classic Hodgkin-Huxley neuron circuit is simulated to obtain output waveforms with degraded capacitors. It has been found that the output waveform of the selected neuron changes significantly with capacitors' degradation. Unless capacitor breaks down, the neural coding method avoids impact of the capacitors' degradation on the received data.
AB - Performance of biomimetic neurons used in novel communication systems depends on its capacitors. Thus, degradation of capacitors in neurons may have significant impact on reliability of such a communication system. In this paper, a simulation-based reliability assessment approach is developed for biomimetic neuron circuits to consider the degradation of capacitors. SPICE simulation, neural coding/decoding method, and degradation modelling of capacitors are integrated to assess impact of capacitors on the given neuron circuit. A classic Hodgkin-Huxley neuron circuit is simulated to obtain output waveforms with degraded capacitors. It has been found that the output waveform of the selected neuron changes significantly with capacitors' degradation. Unless capacitor breaks down, the neural coding method avoids impact of the capacitors' degradation on the received data.
KW - Capacitor
KW - Communication
KW - Hodgkin-Huxley Neuron
KW - Neuromorphic Circuit
UR - https://www.scopus.com/pages/publications/85090415029
U2 - 10.1109/EuroSimE48426.2020.9152741
DO - 10.1109/EuroSimE48426.2020.9152741
M3 - 会议稿件
AN - SCOPUS:85090415029
T3 - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
BT - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
Y2 - 5 July 2020 through 8 July 2020
ER -