TY - GEN
T1 - A pressure-sensing smart stent compatible with angioplasty procedure and its in vivo testing
AU - Chen, Xing
AU - Assadsangabi, Babak
AU - Brox, Daniel
AU - Hsiang, York
AU - Takahata, Kenichi
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - This study advances the technology for 'smart' antenna stents integrated with micro pressure sensors, targeting at providing a non-invasive and rapid diagnosis of stenting-induced complications in a wireless manner. The smart stent device is developed via considering both engineering and clinical practicality with enhanced electromechanical performance over reported counterparts. The fabricated prototypes are assembled on balloon catheters while withstanding crimping forces well greater than 100 N, and show wireless local pressure sensing with a resolution of 12.4 mmHg upon balloon expansion. Using a swine model, the device is successfully operated to demonstrate wireless detection of blood clot formation, as well as real-time tracking of blood pressure change over a mean arterial pressure of 108 mmHg.
AB - This study advances the technology for 'smart' antenna stents integrated with micro pressure sensors, targeting at providing a non-invasive and rapid diagnosis of stenting-induced complications in a wireless manner. The smart stent device is developed via considering both engineering and clinical practicality with enhanced electromechanical performance over reported counterparts. The fabricated prototypes are assembled on balloon catheters while withstanding crimping forces well greater than 100 N, and show wireless local pressure sensing with a resolution of 12.4 mmHg upon balloon expansion. Using a swine model, the device is successfully operated to demonstrate wireless detection of blood clot formation, as well as real-time tracking of blood pressure change over a mean arterial pressure of 108 mmHg.
UR - https://www.scopus.com/pages/publications/85015751185
U2 - 10.1109/MEMSYS.2017.7863358
DO - 10.1109/MEMSYS.2017.7863358
M3 - 会议稿件
AN - SCOPUS:85015751185
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 133
EP - 136
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -