@inproceedings{7497cfac680b4ce28264f72f2e1cb6fa,
title = "A novel segmented equivalent circuit modeling method of TSV in 3D-IC",
abstract = "This paper proposed a novel segmented equivalent circuit modeling method of TSV, which is the key technology of 3D-IC. The electrical parameters of TSV are extracted firstly and then used to finish the equivalent circuit of single TSV and double TSVs structure. The segmented modeling method is realized by segmenting the TSV structure into three parts, namely the top, middle and bottom of the TSV structure. The electrical parameters of the middle part are obtained by analytical formulas, while the parameters of the top and bottom parts are obtained by 3D field solver more accurately. The equivalent circuit of TSV got by this novel method is more accurate compared with the general method. The simulation results of S parameter of the equivalent circuit model are matched well with the simulation results of HFSS while the simulation time is much shorter, and the simulation results show that the equivalent model can reflect the transmission characteristics of TSV accurately.",
keywords = "3D-IC, Equivalent circuit, Segmented modeling method, TSV",
author = "Zhicai Ma and Zhaowen Yan and Ying Xiong and Mengze Zhang and Guochang Shi",
year = "2013",
doi = "10.1109/MAPE.2013.6689924",
language = "英语",
isbn = "9781467360777",
series = "2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2013",
pages = "646--649",
booktitle = "2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2013",
note = "2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2013 ; Conference date: 29-10-2013 Through 31-10-2013",
}