A novel approach to the solid bonding of a TiAl alloy

  • J. G. Lin*
  • , G. S. Yu
  • , G. Q. Wu
  • , Z. Huang
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

A method for the joining of TiAl alloy was investigated using electron beam weldability technique. Laser surface treatment technology was used to obtain a fine grain structure on the surface of the joining samples of a TiAl alloy. Microstructure observation and analysis were conducted using optical microscope and scanning electron microscope. The results show that the bending strength of the joints and base alloy are 134 MPa and 220 MPa respectively while the strength of the joints is 61% of that of the base alloy.

Original languageEnglish
Pages (from-to)1671-1673
Number of pages3
JournalJournal of Materials Science Letters
Volume20
Issue number18
DOIs
StatePublished - 15 Sep 2001

Fingerprint

Dive into the research topics of 'A novel approach to the solid bonding of a TiAl alloy'. Together they form a unique fingerprint.

Cite this