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A Novel All-Digital on-Chip Aging Sensor Robust to Process Variations

  • Beihang University
  • Zhongguancun Laboratory

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the development of semiconductor technology, the reliability of integrated circuit (IC) is challenged by multiple aging mechanisms, which could increase the delay of ICs and cause timing violations. Hence, it is necessary to monitor the aging degree of the IC in real time. In this paper, we present a novel on-chip aging sensor based on path delay measurement, which can perform accurate measurement in two clock cycles. The proposed sensor is all-digital with low area overhead. Experiment result shows that the random measurement error is less than 2.92ps during 2 years aging. In addition, the sensor is robust to process variations.

Original languageEnglish
Title of host publication2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages578-583
Number of pages6
ISBN (Electronic)9781665460439
DOIs
StatePublished - 2022
Event7th International Conference on Integrated Circuits and Microsystems, ICICM 2022 - Xi'an, China
Duration: 28 Oct 202231 Oct 2022

Publication series

Name2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022

Conference

Conference7th International Conference on Integrated Circuits and Microsystems, ICICM 2022
Country/TerritoryChina
CityXi'an
Period28/10/2231/10/22

Keywords

  • aging monitor
  • chip reliability
  • delay measurement
  • on-chip sensor

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