A new electronic product PHM analytical object identifying method based on failure of physics and simulation

It's essential to identify the vital parts at the blue-print stage of electronic products before the engineers scheme out any method of product fault prognostication and health management. Currently, the vital parts, which are expensive, fragile, or with complex and critical functions, can be confirmed through experience, field data or FMEA method. This paper presents a new method to provide a list contains all components and potential failure points which need to be paid attention to at the scheming stage. The electronic designers can make a decision if the weak points of the electronic product are possible and necessary to take any prognostication and health management technique. In this method, Numerical Heat Transfer (NHT) and Finite Element Analysis (FEA) have to be applied on the electronic product to obtain the localized environment condition firstly. And based on the failure of physics theory, various failure models, which describe material thermal mismatch as well as the fatigue crack caused by vibration, can be used to identify the failure time, failure mode and mechanism of every component and other potential failure points. Consequently, the vital parts of the electronic product which work under harsh environment and may lead to critical failure can be focused seriously, while the capacity parameters should be monitored during the whole life-cycle. Additionally, the alternative method shown in this paper is applied on an avionic printed circuit assembly as the cased study.