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A Neural Network-Based Performance Assessment Approach for Heat-Dissipating Microchannels in Packages

  • Bo Sun*
  • , Zhenhao Tang
  • , Kunzhao Li
  • , Chunbing Guo
  • *Corresponding author for this work
  • Guangdong University of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To address the severe computational bottleneck imposed by three-dimensional conjugate heat transfer (CHT) simulations in the thermal design of micro-channel heat sinks (MCHSs), this study develops a high-throughput automated CFD pipeline that integrates geometric feasibility constraints with a cryptographic SHA256-based data-freezing mechanism. From 791 randomly generated designs with extreme geometric characteristics, 638 valid high-fidelity structured samples were retained after strict numerical and geometric screening. On this physically consistent dataset, a physics-informed machine learning (PIML) surrogate was established to map core geometric and derived features to multi-objective thermo-hydraulic responses. For the most challenging target, pressure drop, fluid-mechanics priors including v2 and 1/Dh were explicitly injected into the learning space to improve robustness under highly nonlinear operating conditions. Quantitative results show that the surrogate achieved R2 >.094 on key heat-transfer-related targets such as Nu, maintained a global average MAPE of approximately 567. %, and constrained the local error in the extreme high-pressure-drop regime to 907. %. By replacing kilosecond-level CFD iterations with millisecond-level forward inference, the proposed framework delivered an acceleration of up to O(106) relative to conventional CFD, enabling real-time design-space exploration for next-generation chip thermal management.

Original languageEnglish
Title of host publicationProceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331562496
DOIs
StatePublished - 2026
Externally publishedYes
Event27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026 - Warsaw, Poland
Duration: 19 Apr 202622 Apr 2026

Publication series

NameProceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026

Conference

Conference27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
Country/TerritoryPoland
CityWarsaw
Period19/04/2622/04/26

Keywords

  • Micro-Channel Heat Sink (MCHS)
  • automated CFD
  • deep learning
  • physical priors
  • surrogate model

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