A life prediction model of multilayered PTH based on fatigue mechanism

Yaqiu Li; Weiwei Hu; Yufeng Sun; Zili Wang; Ali Mosleh

doi:10.3390/ma10040382

A life prediction model of multilayered PTH based on fatigue mechanism

Yaqiu Li
, Weiwei Hu^*
, Yufeng Sun
, Zili Wang
, Ali Mosleh

^*Corresponding author for this work

School of Reliability and Systems Engineering

Beihang University
University of California at Los Angeles

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.

Original language	English
Article number	382
Journal	Materials
Volume	10
Issue number	4
DOIs	https://doi.org/10.3390/ma10040382
State	Published - 4 Apr 2017

Keywords

FEA
Fatigue life prediction
PTH
Stress-strain model
Thermal cycling test
multilayer

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10.3390/ma10040382

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title = "A life prediction model of multilayered PTH based on fatigue mechanism",

abstract = "Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.",

keywords = "FEA, Fatigue life prediction, PTH, Stress-strain model, Thermal cycling test, multilayer",

author = "Yaqiu Li and Weiwei Hu and Yufeng Sun and Zili Wang and Ali Mosleh",

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year = "2017",

month = apr,

day = "4",

doi = "10.3390/ma10040382",

language = "英语",

volume = "10",

journal = "Materials",

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TY - JOUR

T1 - A life prediction model of multilayered PTH based on fatigue mechanism

AU - Li, Yaqiu

AU - Hu, Weiwei

AU - Sun, Yufeng

AU - Wang, Zili

AU - Mosleh, Ali

PY - 2017/4/4

Y1 - 2017/4/4

N2 - Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.

AB - Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration. In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.

KW - FEA

KW - Fatigue life prediction

KW - PTH

KW - Stress-strain model

KW - Thermal cycling test

KW - multilayer

UR - https://www.scopus.com/pages/publications/85017419778

U2 - 10.3390/ma10040382

DO - 10.3390/ma10040382

M3 - 文章

AN - SCOPUS:85017419778

SN - 1996-1944

VL - 10

JO - Materials

JF - Materials

IS - 4

M1 - 382

ER -

A life prediction model of multilayered PTH based on fatigue mechanism

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Keywords

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