A fatigue life model of BGA solder joints based on energy

Jiamin Liu; Weiwei Hu; Hao Chen; Jiuxing Wang

doi:10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy

Jiamin Liu
, Weiwei Hu
, Hao Chen
, Jiuxing Wang

School of Reliability and Systems Engineering

Beihang University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

Original language	English
Title of host publication	2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017
Editors	Dongming Fan, Jun Yang, Ziyao Wang, Tingdi Zhao
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781538609187
DOIs	https://doi.org/10.1109/ICRSE.2017.8030795
State	Published - 8 Sep 2017
Event	2nd International Conference on Reliability Systems Engineering, ICRSE 2017 - Huairou, Beijing, China Duration: 10 Jul 2017 → 12 Jul 2017

Publication series

Name	2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

Conference

Conference	2nd International Conference on Reliability Systems Engineering, ICRSE 2017
Country/Territory	China
City	Huairou, Beijing
Period	10/07/17 → 12/07/17

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

accelerated test
BGA solder joints
life prediction
simulation
thermal fatigue

Access to Document

10.1109/ICRSE.2017.8030795

Cite this

Liu, J., Hu, W., Chen, H., & Wang, J. (2017). A fatigue life model of BGA solder joints based on energy. In D. Fan, J. Yang, Z. Wang, & T. Zhao (Eds.), 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017 Article 8030795 (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICRSE.2017.8030795

Liu, Jiamin ; Hu, Weiwei ; Chen, Hao et al. / A fatigue life model of BGA solder joints based on energy. 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. editor / Dongming Fan ; Jun Yang ; Ziyao Wang ; Tingdi Zhao. Institute of Electrical and Electronics Engineers Inc., 2017. (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017).

@inproceedings{9f3a03a4a6144deb84ada4ea605a9938,

title = "A fatigue life model of BGA solder joints based on energy",

abstract = "In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.",

keywords = "accelerated test, BGA solder joints, life prediction, simulation, thermal fatigue",

author = "Jiamin Liu and Weiwei Hu and Hao Chen and Jiuxing Wang",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2nd International Conference on Reliability Systems Engineering, ICRSE 2017 ; Conference date: 10-07-2017 Through 12-07-2017",

year = "2017",

month = sep,

day = "8",

doi = "10.1109/ICRSE.2017.8030795",

language = "英语",

series = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

editor = "Dongming Fan and Jun Yang and Ziyao Wang and Tingdi Zhao",

booktitle = "2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017",

address = "美国",

}

Liu, J, Hu, W, Chen, H & Wang, J 2017, A fatigue life model of BGA solder joints based on energy. in D Fan, J Yang, Z Wang & T Zhao (eds), 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017., 8030795, 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Institute of Electrical and Electronics Engineers Inc., 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Huairou, Beijing, China, 10/07/17. https://doi.org/10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy. / Liu, Jiamin; Hu, Weiwei; Chen, Hao et al.
2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. ed. / Dongming Fan; Jun Yang; Ziyao Wang; Tingdi Zhao. Institute of Electrical and Electronics Engineers Inc., 2017. 8030795 (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A fatigue life model of BGA solder joints based on energy

AU - Liu, Jiamin

AU - Hu, Weiwei

AU - Chen, Hao

AU - Wang, Jiuxing

PY - 2017/9/8

Y1 - 2017/9/8

N2 - In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

AB - In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

KW - accelerated test

KW - BGA solder joints

KW - life prediction

KW - simulation

KW - thermal fatigue

UR - https://www.scopus.com/pages/publications/85032259179

U2 - 10.1109/ICRSE.2017.8030795

DO - 10.1109/ICRSE.2017.8030795

M3 - 会议稿件

AN - SCOPUS:85032259179

T3 - 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

BT - 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

A2 - Fan, Dongming

A2 - Yang, Jun

A2 - Wang, Ziyao

A2 - Zhao, Tingdi

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2nd International Conference on Reliability Systems Engineering, ICRSE 2017

Y2 - 10 July 2017 through 12 July 2017

ER -

Liu J, Hu W, Chen H, Wang J. A fatigue life model of BGA solder joints based on energy. In Fan D, Yang J, Wang Z, Zhao T, editors, 2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 8030795. (2017 2nd International Conference on Reliability Systems Engineering, ICRSE 2017). doi: 10.1109/ICRSE.2017.8030795

A fatigue life model of BGA solder joints based on energy

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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