A comprehensive review on advanced microchannel cooling technologies: two-phase thermal management and machine learning applications

Currently, the advancement of power devices is characterized by trends towards miniaturization, integration, high power, and high heat flux. However, these developments also lead to the risk of thermal failure encountered by devices. To tackle this challenge, both academia and industry have started to focus on research into efficient thermal management technologies. This paper reviews the latest advancement and technological progress on the topic of efficient thermal management technology of power devices. Through the comprehensive analysis and summary, we found that thermal management capability of power devices has been enhanced thanks to the rapid development of embedded microchannel fabrication technology. Furthermore, research focus on two-phase heat transfer, rather than single-phase cooling systems, has brought about innovations in embedded microchannel thermal management, along with the emergence of new challenges. Moreover, in order to further exploit the optimization potential of power device thermal management, it's a good method to incorporate Machine Learning (ML) techniques to optimize the flow channel structure and thermal management strategy and to predict the performance of the whole system. We expect that with the extensive study of the above cutting-edge technologies for thermal management of power device, the thermal performance of these devices will experience significant advancement over the next five to ten years. These innovations are reflected in the smaller and thinner cooling structure, the less cooling medium, the more efficient cooling performance, and the more intelligent thermal management.