TY - GEN
T1 - A bulk micromachined Si-on-glass tunneling accelerometer with out-of-plane sensing capability
AU - Miao, Min
AU - Hu, Qifang
AU - Hao, Yilong
AU - Dong, Haifeng
AU - Wang, Ling
AU - Shi, Yunbo
AU - Shen, Sanmin
PY - 2007
Y1 - 2007
N2 - A bulk micromachined tunneling accelerometer on Pyrex 7740 glass substrate is reported in this paper, which is capable of out-of-plane sensing and intended for highly sensitive inertial measurements. Low stress in single crystal Si (SCS) proof mass-suspension structure and low thermal incompatibility between SCS structural layer and substrate can minimize low frequency noise of the device. Double-face ICP etchings are utilized to define the movable proof mass and suspension: one made on the face with the tip to partially defines the movable structure before anodic bonding, and another made to releases the movable structure after the bonding. The process can avoid severe blades, as found on beams of samples fabricated with previous process. A 3-order closed loop control circuit is used to keep the tip staying close to the optimal operation position and to ensure favorable linearity over the measuring range. Theoretical analysis and design of the control electronics are presented. The device is tested in low noise environment and the result shows an excellent low frequency resolution of 0.015mg/rtHz (@1-100Hz), and nonlinearity <2% over ±10g input (<1% over ±1g).
AB - A bulk micromachined tunneling accelerometer on Pyrex 7740 glass substrate is reported in this paper, which is capable of out-of-plane sensing and intended for highly sensitive inertial measurements. Low stress in single crystal Si (SCS) proof mass-suspension structure and low thermal incompatibility between SCS structural layer and substrate can minimize low frequency noise of the device. Double-face ICP etchings are utilized to define the movable proof mass and suspension: one made on the face with the tip to partially defines the movable structure before anodic bonding, and another made to releases the movable structure after the bonding. The process can avoid severe blades, as found on beams of samples fabricated with previous process. A 3-order closed loop control circuit is used to keep the tip staying close to the optimal operation position and to ensure favorable linearity over the measuring range. Theoretical analysis and design of the control electronics are presented. The device is tested in low noise environment and the result shows an excellent low frequency resolution of 0.015mg/rtHz (@1-100Hz), and nonlinearity <2% over ±10g input (<1% over ±1g).
KW - Bulk micromachining
KW - High resolution
KW - Inductively coupled plasma
KW - Inertial technology
KW - Microelectromechanical system ( MEMS )
KW - Nanoelectro-mechanical system (NEMS)
KW - Tunneling accelerometer
UR - https://www.scopus.com/pages/publications/34548167838
U2 - 10.1109/NEMS.2007.352270
DO - 10.1109/NEMS.2007.352270
M3 - 会议稿件
AN - SCOPUS:34548167838
SN - 1424406102
SN - 9781424406104
T3 - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
SP - 235
EP - 240
BT - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
T2 - 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Y2 - 16 January 2007 through 19 January 2007
ER -