A brief review of FEM simulation techniques for IC packaging under impact load

In this paper, several key issues in FEM analysis of IC packaging under impact loading is discussed based on existing references, including IMC simulation, failure modes, and submodel method. Intermetallic compound (IMC) is widely observed in BGA packaging, the failure mode depends greatly on the IMC. As the solder is strengthened with the increase of the strain-rate, the failure mode turned from solder failure to IMC failure, the highest strain rate will even cause pad lift of the packaging. A popular way to simulate its failure procedure in FEM model is cohesive zone model(CZM), the theoretical foundation and the determination of parameters are summarized. Submodel technique is widely used in thermo-mechanical analysis of IC packaging, while few applications of this submodel method can be found in dynamic analysis. It's suggested that the nonlinear properties can be ignored until the submodel was to be implemented, which decrease the computation complexity drastically.