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基于交错磁自旋劈裂的简化双层隧道结隧穿磁阻

Translated title of the contribution: Tunneling magnetoresistance in a simplified bilayer tunnel junction based on altermagnetic spin splitting
  • Beihang University

Research output: Contribution to journalArticlepeer-review

Abstract

Altermagnetic materials have recently broken through the spin degeneracy limitation of conventional antiferromagnetic tunnel junctions, offering new opportunities for developing novel spintronic devices. However, maintaining high thermal stability and significant tunneling magnetoresistance (TMR) while utilizing altermagnetic semiconductors to simplify device architecture remains a key challenge for achieving high-density storage devices. This work presents a tunnel junction based on a V2Se2O/Fe2B van der Waals heterostructure. By exploiting the spin-splitting effect in the momentum space of altermagnetic materials, this structure overcomes the inability to achieve TMR in conventional antiferromagnetic tunnel junctions due to spin degeneracy. Simultaneously, the exchange bias effect at the ferromagnetic/altermagnetic interface effectively enhances the thermal stability of the ferromagnetic layer, replacing the conventional synthetic antiferromagnetic pinning layer and significantly simplifying the device architecture. First-principles calculations based on density functional theory combined with non-equilibrium Green’s function demonstrate that the V2Se2O/Fe2B heterostructure achieves a TMR of 283% at room temperature, with further optimization potential through material doping or electrostatic gating. This study demonstrates the feasibility and application prospect of altermagnetic materials in next-generation spintronic memory devices, while substantially reducing structural complexity and enhancing thermal stability.

Translated title of the contributionTunneling magnetoresistance in a simplified bilayer tunnel junction based on altermagnetic spin splitting
Original languageChinese (Traditional)
Article number080707
JournalWuli Xuebao/Acta Physica Sinica
Volume75
Issue number8
DOIs
StatePublished - 20 Apr 2026

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