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可拉伸柔性电路的原位封装3D打印工艺

Translated title of the contribution: In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits
  • Weijun Zhu*
  • , Yankun Chen
  • , Zhikun Zhang
  • , Xiaoyong Tian
  • , Dichen Li
  • *Corresponding author for this work
  • Xi'an Jiaotong University

Research output: Contribution to journalArticlepeer-review

Abstract

The stretchable flexible circuit is a key component of stretchable flexible electronics. Metal copper wires have good electrical properties, mechanical properties, thermal conductivity, etc., and are widely used in the electronics industry. However, conventionally printed copper-based circuits are not stretchable and cannot be directly used for flexible electronics. Therefore, based on the flexible design of the circuit structure and 3D printing processing technology, an in-situ package 3D printing technology for stretchable flexible metal wire circuits is proposed to realize coaxial printing of stretchable metal wires and their encapsulation layers. It is embedded in the printed flexible encapsulation film, and finally the integrated processing of the stretchable flexible circuit is completed. A metal wire in-situ package structure with stretchable deformation is designed. The nozzle structure that can be used for in-situ package printing is developed. The in-situ package 3D printing process is studied. Based on this, the tensile properties of the flexible circuit are studied. An integrated 3D printing technology with multi-material multi-function structure is developed, the application of this technology in the processing of stretchable flexible circuits is explored, and a new idea for the design and processing of flexible electronics is provided.

Translated title of the contributionIn-situ Packaging 3D Printing Process for Stretchable Flexible Circuits
Original languageChinese (Traditional)
Pages (from-to)64-70
Number of pages7
JournalJixie Gongcheng Xuebao/Journal of Mechanical Engineering
Volume55
Issue number15
DOIs
StatePublished - 5 Aug 2019
Externally publishedYes

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