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Dive into the research topics where Sujuan Zhang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Evaluation Method of Residual Life of Extended Stored Electronic Components Based on Electrical Parameter Degradation
Qiao, Y., Zheng, X., Zhang, S., Zhang, D. & Cui, S., 2024, Proceedings - 2024 10th International Symposium on System Security, Safety, and Reliability, ISSSR 2024. Institute of Electrical and Electronics Engineers Inc., p. 38-43 6 p. (Proceedings - 2024 10th International Symposium on System Security, Safety, and Reliability, ISSSR 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Finite Element Modelling and Life Prediction of Solder Joints of Board Level Devices Under Power Cyclic Load
Luo, A., Wan, B., Su, Y. & Zhang, S., 2024, Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2024—Volume 1. Zhou, K. (ed.). Springer Science and Business Media B.V., p. 153-164 12 p. (Mechanisms and Machine Science; vol. 168 MMS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Infrared Thermal Imaging-Based Power MOSFET Thermal Resistance Test Method Research
Shao, H., Zhang, S., Wan, B., Wang, Y. & Long, M., 2023, 2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023. Guo, W. & Li, S. (eds.). Institute of Electrical and Electronics Engineers Inc., (2023 Global Reliability and Prognostics and Health Management Conference, PHM-Hangzhou 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Research on solder joint stress damage evaluation method based on discrete SSI model
Rong, K. Y., Zhang, S. J., Li, Y. R. Y. & Wan, B., 2 Feb 2021, In: IOP Conference Series: Materials Science and Engineering. 1043, 3, 032042.Research output: Contribution to journal › Conference article › peer-review
Open Access -
Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Yuan, J., Zhang, S., Wan, B., Fu, G. & Jiang, M., Nov 2020, In: Microelectronics Reliability. 114, 113814.Research output: Contribution to journal › Article › peer-review
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