Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy
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Dive into the research topics where Guicui Fu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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A Novel Surface-Potential-Based Modeling Methodology of SiC MOSFET With Physics-Informed Neural Network
Yang, B., Fu, G. & Wan, B., 2026, In: IEEE Transactions on Electron Devices. 73, 1, p. 187-199 13 p.Research output: Contribution to journal › Article › peer-review
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Study on the influence of multi-dimensional warpage on the reliability of PBGA solder joints
Ding, Y., Fu, G. & Wan, B., 14 Jan 2026, Fifth International Conference on Advanced Manufacturing Technology and Electronic Information, AMTEI 2025. Dong, B. & Chen, Y. (eds.). SPIE, 140661H. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 14066).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A fatigue lifetime prediction model applicable to porous sintered Ag nanoparticles
Zhang, Z., Fu, G., Wan, B. & Su, Y., 2025, In: Eksploatacja i Niezawodnosc. 27, 3, 201429.Research output: Contribution to journal › Article › peer-review
Open Access -
An Electrical Behavior Analysis Method of Esd Protection Structure in Chip Based on Spice
Shen, S., Wang, X., Wan, B. & Fu, G., 2025, IEEE Region 10 Conference 2025: Unleashing Innovation: Elevating Technologies to New Horizon, TENCON 2025. Institute of Electrical and Electronics Engineers Inc., p. 659-663 5 p. (IEEE Region 10 Annual International Conference, Proceedings/TENCON).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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An interface trap density evaluation method for SiC MOSFET based on neural network
Yang, B., Fu, G., Wan, B. & Wang, X., Dec 2025, In: Microelectronics Reliability. 175, 115934.Research output: Contribution to journal › Article › peer-review